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図解 最先端半導体パッケージ技術のすべて／半導体新技術研究会【編】，村上元【監修】
| Buy It Now Price | 2750 JPY |
| Tax | 275 JPY |
| Number of Bids | 0 |
| Time Left |
| Auction Detail | |
|---|---|
| Product Qty | 1 |
| Buy It Price | 2750 JPY |
| Starting Time | Jun/21/2024 02:36:28 |
| Ending Time | Jun/28/2024 02:36:56 |
| Condition | used20 |
| Auction ID | 1126989913 |
Item Description
Translation is provided as a convenience. You agree that you understand the original auction details written in Japanese and are fully responsible to bid on this item.
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